Qubit Chip

Danna Rosenberg, David K. Kim, Rabindra Nath Das +12 more

Abstract As the field of quantum computing advances from the few-qubit stage to larger-scale processors, qubit addressability and extensibility will necessitate the use of 3D integration and packaging. While 3D integration is well-developed for commercial electronics, relatively little work has been performed to determine its compatibility with high-coherence solid-state qubits. Of particular concern, qubit coherence times can be suppressed by the requisite processing steps and close proximity of another chip. In this work, we use a flip-chip process to bond a chip with superconducting flux qubits to another chip containing structures for qubit readout and control. We demonstrate that high qubit coherence ( T 1 , T 2,echo > 20 μs) is maintained in a flip-chip geometry in the presence of galvanic, capacitive, and inductive coupling between the chips.

Arnab Dey

Charles Q. Choi

Shu-Ya Wang, Dong-Sheng Wang, Xiao-Han Yu +7 more

High-fidelity quantum interconnection remains a critical challenge for scaling up superconducting quantum chips. Here, we realize a simple fixed coupling scheme to achieve high-fidelity two-qubit gate operation across separate superconducting quantum chips. In this scheme, qubit-qubit coupling between separate chips can be realized via exchange interaction mediated by a bus resonator. By merely tuning the frequency of a single qubit, the resonant mode of the bus resonator can be modulated, enabling high-quality and stable quantum interconnection across different chips. Consequently, the experimentally implemented two-qubit gate operations between separate chips exhibit excellent performance, with a maximum two-qubit CZ gate fidelity reaching 99.57%. This work lays a technical foundation for the realization of high-fidelity chip-to-chip quantum interconnection, which facilitates the development of large-scale superconducting quantum chips with high fidelity.

Marcus Stephen Edwards

Shinichi Yorozu, Toshiyuki Miyazaki, Vasili K. Semenov +6 more

Superconducting single flux quantum (SFQ) circuit can operate at very low temperature. This is suitable for controlling a quantum computing system with Josephson junctions. However, it is difficult to integrate both SFQ circuits and qubits into a single-chip, because of the dissipative characteristics of SFQ circuits. Therefore, we have developed a multi-chip packaging technology for a qubit control module. The module consists of SFQ circuit chips, qubit chips, and a substrate all of which are fabricated with Nb and Al technology. The chips are flip-chip bonded with superconducting solder bumps. We also investigated SFQ control circuits for superconducting qubits and circuit parameter optimization for sub-Kelvin temperature operation. Using both multi-chip packaging and optimized SFQ control circuit makes the design of qubit control module more flexible.