Challenges
Datasets
Workspaces
Papers
Discussions
Leaderboard
Log inSign up
Challenges
Datasets
Workspaces
Papers
Discussions
Leaderboard
Blog
Job Board
Q3AS

© 2026 Aqora Quantum S.A.S.

TermsPrivacyLegal Notice

Springer eBooks

Trap processes

Published Apr 29, 2008• 0 citations
Publisher
DOI
10.1007/bfb0119357

Related papers

Trap Effects

Gerard T. Higgins

Springer theses•Jan 1, 2019•0 citations

Optimization of the Loading Process of the QUIC Magnetic Trap for the Experiment of Bose–Einstein Condensation

Shuai Chen, Xiaoji Zhou, Yang Fan +3 more

The magnetic quadrupole-Ioffe configuration (QUIC) trap in our Bose–Einstein condensation experiment is introduced. The magnetic trap loading process after laser cooling is analysed and the optimization of the loading process is studied experimentally. Calculation of the magnetic field explains the loss of the atoms during the loading process of the QUIC trap. The number of atoms loaded in the QUIC trap is increased by 40% after optimization in comparison with the normal loading process.

Chinese Physics Letters•Oct 27, 2004•3 citations

Feedback Trap

Momčilo M. Gavrilov

Springer theses•Jan 1, 2017•0 citations

Optimization of the Loading Process of the QUIC Magnetic Trap for the Experiment of Bose-Einstein Condensation

陈帅, 周小计, Fan Yang +3 more

The magnetic quadrupole-Ioffe configuration (QUIC) trap in our Bose-Einstein condensation experiment is introduced. The magnetic trap loading process after laser cooling is ana/ysed and the optimization of the loading process is studied experimentally, Calculation of the magnetic field explains the loss of the atoms during the loading process of the QUIC trap. The number of atoms loaded in the QUIC trap is increased by 40% after optimization in comparison with the normal loading process.

Chinese Physics Letters•Jan 1, 2004•0 citations

Ion traps fabricated in a CMOS foundry

Karan K. Mehta, Amira M. Eltony, Colin Bruzewicz +4 more

We demonstrate trapping in a surface-electrode ion trap fabricated in a 90-nm CMOS (complementary metal-oxide-semiconductor) foundry process utilizing the top metal layer of the process for the trap electrodes. The process includes doped active regions and metal interconnect layers, allowing for co-fabrication of standard CMOS circuitry as well as devices for optical control and measurement. With one of the interconnect layers defining a ground plane between the trap electrode layer and the p-type doped silicon substrate, ion loading is robust and trapping is stable. We measure a motional heating rate comparable to those seen in surface-electrode traps of similar size. This demonstration of scalable quantum computing hardware utilizing a commercial CMOS process opens the door to integration and co-fabrication of electronics and photonics for large-scale quantum processing in trapped-ion arrays.

arXiv:1406.3643•Applied Physics Letters•Jul 28, 2014•64 citations

Loading of Traps

Springer eBooks•Nov 9, 2005•0 citations
We demonstrate trapping in a surface-electrode ion trap fabricated in a 90-nm CMOS (complementary metal-oxide-semiconductor) foundry process utilizing the top metal layer of the process for the trap electrodes. The process includes doped active regions and metal interconnect layers, allowing for co-fabrication of standard CMOS circuitry as well as devices for optical control and measurement. With one of the interconnect layers defining a ground plane between the trap electrode layer and the p-type doped silicon substrate, ion loading is robust and trapping is stable. We measure a motional heating rate comparable to those seen in surface-electrode traps of similar size. This demonstration of scalable quantum computing hardware utilizing a commercial CMOS process opens the door to integration and co-fabrication of electronics and photonics for large-scale quantum processing in trapped-ion arrays.