The capability of realizing quantum photonics implementations on-chip will have a strong impact on several aspects of quantum computation and information processing. The implementation of large scale integrated quantum photonic technologies requires on-chip reconfigurable waveguide circuits as well as single-photon sources and detectors. Many successes have been made in recent years to demonstrate complex quantum circuits in many material platforms. Among all these platforms, the Silicon-on-Insulator (SOI) platform is outstanding as it is well developed for classical applications and therefore deploys a high component density, mature fabrication techniques and compatibility with the telecom regime and the complementary metal-oxide-semiconductor (CMOS) technology. However, the lack of on-demand non-classical light sources, directly incorporated in silicon chips, forces the use of nonlinear processes to generate non-classical light states: the probabilistic nature of the emission process sets a limit in the maximally achievable experimental complexity. The use of on-demand sources will have a strong impact on the device’s scalability.
The capability of realizing quantum photonics implementations on-chip will have a strong impact on several aspects of quantum computation and information processing. The implementation of large scale integrated quantum photonic technologies requires on-chip reconfigurable waveguide circuits as well as single-photon sources and detectors. Many successes have been made in recent years to demonstrate complex quantum circuits in many material platforms. Among all these platforms, the Silicon-on-Insulator (SOI) platform is outstanding as it is well developed for classical applications and therefore deploys a high component density, mature fabrication techniques and compatibility with the telecom regime and the complementary metal-oxide-semiconductor (CMOS) technology. However, the lack of on-demand non-classical light sources, directly incorporated in silicon chips, forces the use of nonlinear processes to generate non-classical light states: the probabilistic nature of the emission process sets a limit in the maximally achievable experimental complexity. The use of on-demand sources will have a strong impact on the device’s scalability.
The well-established silicon-on-insulator platform is very promising for large-scale integrated photonic and quantum photonic technologies due to the mature manufacturing technology and integration density. Here, we present an efficient and stable fiber-to-chip coupling, which enables the injection of single photons from telecom quantum dots into a silicon-on-insulator photonic chip. Two additional fibers further couple the chip to single-photon detectors. The approach chosen to achieve steady fiber-chip coupling is based on the use of grating couplers steadily packaged with angled single-mode fibers. Using this technique, coupling efficiencies between the fiber and the SOI chip as high as 69.1% per grating coupler (including the taper losses) are reached. The effective interface between the quantum light generated by quantum dots and the silicon components is verified via the measurement of the second-order correlation function using a Hanbury–Brown and Twiss setup. With g(2)(0)=0.051±0.001, it clearly proves the single-photon nature of the injected QD photons. This demonstrates the reliability of the interfacing method and opens the route to employ telecom quantum dots as non-classical light sources with high complexity silicon photonic functionalities.
Abstract High-dimensional quantum entanglement is an important resource for emerging quantum technologies such as quantum communication and quantum computation. The scalability of metres-long experimental setups limits high-dimensional entanglement in bulk optics. Advancements in quantum technology hinge on reproducible, and reconfigurable quantum devices—including photon sources, which are challenging to achieve in a scalable manner using bulk optics. Advances in nanotechnology and CMOS-compatible integration techniques have enabled the generation of entangled photons on millimeter-scale chips, significantly enhancing scalability, stability, replicability, and miniaturization for real-world quantum applications. In recent years we have seen several chip-scale demonstrations with different discrete degrees of freedom including path, frequency-bin, time-bin, and transverse modes, on many material platforms. A complete quantum photonic integrated circuit requires the generation, manipulation, and detection of quantum states, involving various active and passive quantum photonic components which further increase the degree of complexity. Here, we focus on the high-dimensional versions of qubits—qudits—and review the nonlinear optical processes that facilitate on-chip high-dimensional entangled photon sources, and the currently used material platforms. We discuss a range of current implementations of on-chip high-dimensional entangled photon sources and demonstrated applications. We comment on the current challenges due to the limitations of individual material platforms and present future opportunities in hybrid and heterogeneous integration strategies for the next generation of integrated quantum photonic chips.
In the past decades quantum optics has been at the forefront of quantum innovative technologies. For practical applications, scalable platforms for implementation of quantum optical circuits are vital. This thesis presents two new platforms for scalable implementation of quantum optical circuits, namely, modular approach and monolithic integration. Here, we take the first steps towards the integration of three main elements of every quantum optics circuits: Single-photon emitters, single-photon detectors, and quantum logics. Until now, most quantum optical circuits used separate platforms for single-photon generation and detection. The main challenge in the integration of these technologies, which have different requirements, has slowed down the research in the field. Here, we integrate sources and detectors by first fabricating the devices on their own platform and then transferring and combining them together. Plasma enhanced chemical vapor deposition of silicon nitride followed by etching optical waveguides connect these elements. Removing the Poissonian optical excitation field from the quantum circuit is necessary for integration. Classical optical excitation can be avoided if the sources are electrically pumped. However, fabrication of high-quality electrically pumped sources, suitable for integration, has been limited. The experiments described in chapter 4 are our first step towards addressing the mentioned problem. Defect-free nanowires are grown on <100> direction and their optoelectronic performance are characterized. Nanowire quantum dots, thanks to their waveguiding, purity, coherence and their potentials for deterministic integration with other optical circuits, are promising single-photon sources for on-chip quantum optics. However, precise control of the emission energy of the quantum dots by growth has not become possible yet. Chapter 5 describes a method for on-chip tuning of emission energy of nanowire quantum dots using strain fields. We show the emission energy of independent nanowire quantum dots can be brought into degeneracy without affecting their single-photon emission properties. The quantum optical components have to be routed and connected together to form functional circuits. On a chip, this is usually carried out using optical waveguides. Moreover, manipulation of single photons has to be done in a scalable fashion. Again optical waveguides and ring resonators are very good candidates for this task. Therefore, understanding the behavior of these circuits such as their losses, polarization dependence, and temperature behavior is important. The experiment described in chapter 6 studies the behavior of plasma enhanced silicon nitride waveguides in cryogenic temperatures. We concluded in this chapter that due to weak thermo-optic sensitivity of silicon nitride at cryogenic temperatures, the available thermal budget on the system should be carefully considered. An important step in achieving a scalable platform for quantum optical circuits is deterministic and efficient integration of single-photon sources. In chapter 7, we demonstrate successful integration of III-V nanowire quantum dots with silicon nitride waveguides. The nanowires are deterministically selected and transferred from the original growth chip to the new substrate where they are integrated with low-loss silicon nitride waveguides. Our measurements show that the integrated sources preserve their high quality emission properties. In chapter 8, we describe an alternative approach: amodular method for scalable quantum optics. The proposed technique is based on coupling the single-photon from sources into optical fibers where the photons can be processed and then fed into the single-photon detectors. This approach has high flexibility and is easier to implement but as described in the chapter, at the moment, losses in the interfaces between optical fibers and single-photon sources are a major limiting factor. We conclude the thesis with some possible future directions and exciting new results on integration of single-photon detectors with sources and waveguides. Finally, primary results on on-chip single-photon filtering and removal of the optical excitation field are demonstrated.
Chip-scale integrated photonic circuits provide an attractive platform for the implementation of many quantum photonic technologies ranging from precise metrology to secure communication and quantum computation. In particular, silicon photonic platforms support micron-scale nonlinear optical sources of non-classical light which can be mass manufactured using the robust fabrication processes pioneered by the CMOS microelectronics industry. Integration of these quantum photonic sources with high-performance classical photonic devices on the same chip is required for truly scalable quantum information technologies. Integrated nonlinear resonators are investigated as sources of quantum mechanically correlated photon pair sources. An all-order dispersion engineering method is presented as a robust design synthesis for micoring sources. In addition, a novel concept of coupled mode dispersion compensation is proposed and demonstrated, providing significantly improved performance characteristics of resonant four-wave mixing sources. Next a photon pair source is demonstrated in a commercial CMOS microelectronics process opening the door to future integration of quantum photonics with electronic logic and control circuits. Classical nonlinear optical measurements of stimulated four-wave mixing are used for the first time to accurately predict the quantum correlations from the same device operating in the photon pair regime. Next the first demonstration of fully on-chip pump rejection is demonstrated with over 95 dB pump extinction improving the figures of merit from previous demonstrations by multiple orders of magnitude, including losses, detected pair rates and size. Finally, proposals for introducing novel degrees of freedom provided by an integrated platform are presented for further improving the performance of both photon pair and classical nonlinear optical sources.
Optical chips for quantum photonics are cutting-edge technology, merging photonics and quantum mechanics to manipulate light at the quantum level. These chips are crucial for advancing quantum computing, secure communication, and precision sensing by integrating photonic components such as waveguides, beam splitters, and detectors to manipulate single photons, the fundamental carriers of quantum information. Key advancements in optical chips include low-loss waveguides, efficient single-photon sources, and high-fidelity quantum gates, all essential for scalable quantum circuits. Integrating these circuits on a chip offers significant advantages in miniaturization, stability, and reproducibility over traditional bulk optics setups. Recent breakthroughs in materials science and nanofabrication have propelled the field forward, enabling the production of chips with higher precision and lower defect rates. Silicon photonics, in particular, has become a prominent platform due to its compatibility with existing semiconductor manufacturing processes, facilitating the integration of quantum photonic circuits with classical electronic systems. Here, we share our vision of the future of optical chips for quantum photonics, which hold promise for various applications. In quantum computing, they enable the development of compact and scalable quantum processors. In communication, they provide the foundation for ultra-secure quantum networks through quantum key distribution. In sensing, they allow for high-precision measurements that surpass classical limits. As research progresses, optical chips are expected to play a critical role in realizing the full potential of quantum technologies.
There has been a strong interest to translate optical quantum technologies into photonic integrated circuits (PICs) as they could provide a stable, compact, and potentially scalable architecture for generating, manipulating, and measuring optical quantum states. Among the various PIC technologies that are being developed, silicon-on-insulator (SOI) PICs have several advantages, including technologically mature foundry fabrication, CMOS-process integration, and high-performance switches, modulators, polarization control, filters, and other essential optical components. However, several components are missing that are needed for quantum information processing tasks. Here, we describe recent progress on augmenting SOI PICs with essential capabilities for photonic quantum technologies — entangled photon sources, single photon detectors, and reconfigurable linear optics unitary transformations — and focus on two central application areas: quantum communications and quantum simulation.