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Electropolishing of superconducting cavities for quantum memory applications

Janka Biznárová

Published Jan 1, 2020• 1 citation
OpenAlex

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Significant improvements in superconducting qubit coherence times have been achieved recently with 3-D microwave waveguide cavities coupled to transmon qubits. While many of the measurements in this direction have utilized superconducting aluminum cavities, other recent work has involved qubits coupled to copper cavities with coherence times approaching 0.1 ms. The copper provides a good path for thermalizing the cavity walls and qubit chip, although the substantial cavity loss makes conventional dispersive qubit measurements challenging. We are exploring various approaches for improving the quality factor of 3-D copper cavities, including electropolishing and coating with superconducting layers of tin. We have characterized these cavities on multiple cooldowns and found tin plating to be robust. In addition, we have performed coherence measurements on transmon qubits in these cavities and observed promising performance.

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The recent implementation of three-dimensional microwave cavities coupled to superconducting transmon qubits has led to dramatic improvements in qubit coherence times [1]. Besides the superconducting aluminum cavities that have been used in many such measurements, other recent experiments have utilized copper cavities [2] with coherence times now approaching 0.1 ms. We are investigating the effects on the quality factor for three-dimensional copper cavities that have the cavity-wall surfaces electropolished and coated with a superconducting tin layer. The copper base provides a good path for thermalizing the cavity walls and qubit chip, while the surface treatment reduces the microwave loss. We have measured a superconducting transmon qubit in such a cavity and we report our low-temperature coherence results on the same qubit and cavity measured in two different labs.
Significant improvements in superconducting qubit coherence times have been achieved recently with 3-D microwave waveguide cavities coupled to transmon qubits. While many of the measurements in this direction have utilized superconducting aluminum cavities, other recent work has involved qubits coupled to copper cavities with coherence times approaching 0.1 ms. The copper provides a good path for thermalizing the cavity walls and qubit chip, although the substantial cavity loss makes conventional dispersive qubit measurements challenging. We are exploring various approaches for improving the quality factor of 3-D copper cavities, including electropolishing and coating with superconducting layers of tin. We have characterized these cavities on multiple cooldowns and found tin plating to be robust. In addition, we have performed coherence measurements on transmon qubits in these cavities and observed promising performance.