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Bulletin of the American Physical Society

Fabrication of Direct Bonded Copper Atom Chips for Harmonic Traps

Matthew B. Squires, Brian L. Kasch, Jonathan Crow, Spencer E. Olson

Published Jun 4, 2014• 0 citations
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Abstract : We present the use of direct bonded copper (DBC) for the straightforward fabrication of high power atom chips. Atom chips using DBC have several benefits: excellent copper/substrate adhesion, high purity, thick (greater than 100 microns) copper layers, high substrate thermal conductivity, high aspect ratio wires, the potential for rapid (less than 8 h) fabrication, and three-dimensional atom chip structures. Two mask options for DBC atom chip fabrication are presented, as well as two methods for etching wire patterns into the copper layer. A test chip, able to support 100 A of current for 2 s without failing, is used to determine the thermal impedance of the DBC. An assembly using two DBC atom chips is used to magnetically trap laser cooled 87Rb atoms. The wire aspect ratio that optimizes the magnetic field gradient as a function of power dissipation is determined to be 0.84:1 (height:width).

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APS•Apr 25, 2012•0 citations
We present the use of direct bonded copper (DBC) for the straightforward fabrication of high power atom chips. Atom chips using DBC have several benefits: excellent copper/substrate adhesion, high purity, thick (>100 μm) copper layers, high substrate thermal conductivity, high aspect ratio wires, the potential for rapid (<8 h) fabrication, and three-dimensional atom chip structures. Two mask options for DBC atom chip fabrication are presented, as well as two methods for etching wire patterns into the copper layer. A test chip, able to support 100 A of current for 2 s without failing, is used to determine the thermal impedance of the DBC. An assembly using two DBC atom chips is used to magnetically trap laser cooled (87)Rb atoms. The wire aspect ratio that optimizes the magnetic field gradient as a function of power dissipation is determined to be 0.84:1 (height:width).
Abstract : We present the use of direct bonded copper (DBC) for the straightforward fabrication of high power atom chips. Atom chips using DBC have several benefits: excellent copper/substrate adhesion, high purity, thick (greater than 100 microns) copper layers, high substrate thermal conductivity, high aspect ratio wires, the potential for rapid (less than 8 h) fabrication, and three-dimensional atom chip structures. Two mask options for DBC atom chip fabrication are presented, as well as two methods for etching wire patterns into the copper layer. A test chip, able to support 100 A of current for 2 s without failing, is used to determine the thermal impedance of the DBC. An assembly using two DBC atom chips is used to magnetically trap laser cooled 87Rb atoms. The wire aspect ratio that optimizes the magnetic field gradient as a function of power dissipation is determined to be 0.84:1 (height:width).
Abstract : During 2005, a new basic research effort was begun to better understand confined cold atom systems and determine if atom interferometry for the detection of rotation was possible utilizing spatially and temporally modulated magnetic fields generated using currents running through traces on microchips. During the next seven years, significant progress has been made in evaluating the constraints posed by both theory and practical experimental considerations. This report encompasses three of these studies: collisional decoherence in trapped interferometers, adjustable microchip ring-traps, and atom chips on direct bonded copper substrates. The first of these describes an analytical model developed to describe the effects of collisions between atoms in a harmonic magnetically confined atom interferometer. The second describes a method to create an agile circular magnetic waveguide for deBroglie waves on a microchip, while the third presents the use of direct bonded copper (DBC) for the straightforward fabrication of high power atom chips. Each of these efforts has incrementally added to our cold atom interferometry knowledge base and has enabled the future construction of a working atom chip based interferometer for the ultrasensitive detection of rotation.