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Bulletin of the American Physical Society

3D integration of superconducting qubits with bump bonds: Part 3

Erik A. Lucero, Evan R. Jeffrey, A. Vainsencher, Paul V. Klimov, Trent Huang, Z. Chen, B. Chiaro, A. Dunsworth, Brooks Foxen, Charles Neill, Chris Quintana, J. Wenner, John M. Martinis

Published Mar 14, 2017• 0 citations

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