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Chinese Physics B

Fabrication of rhenium Josephson junctions

Guangming Xue, Haifeng Yu, Ye Tian, Weiyang Liu, Hongwei Yu, Yu-Feng Ren, Zhao Shi-Ping

Published Sep 1, 2013• 4 citations
Publisher

Abstract

Rhenium is a superconductor with a relatively weak tendency to oxidize, which is advantageous in superconducting quantum circuit and qubit applications. In this work, Re/Al—AlO x /Re Josephson tunnel junctions were fabricated using a selective film-etching process similar to that developed in Nb trilayer technology. The Re films had a superconducting transition temperature of 4.8 K and a transition width of 0.2 K. The junctions were found to be highly reproducible using the fabrication process and their characteristics had good quality with a low leakage current and showed a superconducting gap of 0.55 meV.

DOI
10.1088/1674-1056/22/9/097401

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For high-quality superconducting tunnel junctions (STJs), it is necessary to reduce leakage current as much as possible. We describe the fabrication of niobium STJs using the selective niobium (Nb) etching process and various ways to minimize the leakage current. The experiment shows that the leakage current mainly comes from shorts in the tunnel barrier layer rather than those around the junction edges. Through systematic analysis of the thin film stress, surface morphology and modified junction structures, we fabricate high-quality Nb STJs with a gap voltage of 2.8 mV and a leakage current at 1 mV as low as 8.1% and 0.023% at 4.2 K and 0.3 K, respectively.
A novel process suitable for fabrication superconducting circuitry based on the all refactory material NbN is described. In this process, and in-situ trilayer film composed of NbN/MgO/NbN is used to fabricate Josephson tunnel junctions. Reactive ion etching processes are used to delineate devices and pattern insulators and metallizations. Fabricated junctions have yielded good tunneling characteristics with reasonable current density uniformity and reproducibility. Devices with gap voltages close to 3mV have been achieved for high quality junctions (Vm 20 mV). In addition to the trilayer, there are two wiring layers, two resistor depositions, and two insulation layers, constituting a full NbN based fabrication technology. Using this process, we fabricated and successfully tested thin film DC SQUID and time domain reflectometer (TDR) circuits. Preliminary measurements suggest that the critical temperature of these circuits is well within the operating temperature of commercial two-stage closed cycle refrigerators. (Author)
A novel process suitable for fabricating superconducting circuitry based on the all refractory material NbN is described. In this process, an in-situ trilayer film composed of NbN/MgO/NbN is used to fabricate Josephson tunnel junctions. Reactive ion etching processes are used to delineate devices and pattern insulators and metallizations. Fabricated junctions have yielded good tunneling characteristics with reasonable current density uniformity and reproducibility. Devices with gap voltages close to 5mV have been achieved for high quality junctions. In addition to the trilayer, there are two wiring layers, two resistor depositions, and two insulation layers, constituting a full NbN based fabrication technology. Using this process, we fabricated and successfully tested thin film DC SQUID and time domain reflectometer (TDR) circuits. Preliminary measurements suggest that the critical temperature of these circuits is well within the operating temperature of commercial two-stage closed cycle refrigerators.
We have developed a fabrication process for nanoscale tunnel junctions which includes focused-ion-beam etching from different directions. By applying the process to a Nb/(Al–)Al2O3/Nb trilayer, we have fabricated a Nb single-electron transistor (SET), and characterized the SET at low temperatures, T=0.04–40 K. The superconducting gap energy and the transition temperature of the Nb SET agree with the bulk values, which suggests high quality Nb junctions. The single-electron charging energy of the SET is estimated to be larger than 1 K.
A description of the fabrication technology of high-quality tunnel SIS junctions is presented, with following characteristics: energy gap in superconductors Vg=3.2-3.4 mV, tunnel current density up to J 35 kA/cm2, quality factor Rj/Rn (ratio of subgap resistance to normal-state resistance) up to 30, junction area up to 1 μm2. The SIS junctions are integrated into the NbTiN|SiO2|Al microstrip line. Keywords: superconducting devices, superconductor--insulator--superconductor tunnel junction, plasma etching.