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IEEE Transactions on Magnetics

NbCN Josephson junctions with AlN barriers

S.L. Thomasson, James M. Murduck, Huang-Tian Chan

Published Mar 1, 1991• 11 citations

Abstract

Niobium carbonitride (NbCN) Josephson circuits can operate over a wider temperature range than either niobium or niobium nitride circuits. Higher operating temperature places NbCN technology more comfortably within the range of closed-cycle refrigerators, a key factor in aerospace applications. Tunnel junctions have been fabricated from NbCN films with transition temperatures up to 18 K. High-quality NbCN tunnel junction fabrication generally requires low stress films with roughness less than the barrier thickness ( approximately=20 AA). Scanning tunneling microscopy was developed as a tool for measuring and optimizing film smoothness. Junctions formed in situ with AlN tunneling barriers show reproducible I-V characteristics. Unlike NbN, NbCN oxidizes readily, enabling junction definition by a modified SNAP process. This SNAP lithography technique successfully produced NbCn/AlN/NbCN junctions with V/sub m/ values (at 3 mV) up to 27 mV.

DOI: 10.1109/20.133889

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Niobium carbonitride (NbCN) Josephson circuits can operate over a wider temperature range than either niobium or niobium nitride circuits. Higher operating temperature places NbCN technology more comfortably within the range of closed-cycle refrigerators, a key factor in aerospace applications. Tunnel junctions have been fabricated from NbCN films with transition temperatures up to 18 K. High-quality NbCN tunnel junction fabrication generally requires low stress films with roughness less than the barrier thickness ( approximately=20 AA). Scanning tunneling microscopy was developed as a tool for measuring and optimizing film smoothness. Junctions formed in situ with AlN tunneling barriers show reproducible I-V characteristics. Unlike NbN, NbCN oxidizes readily, enabling junction definition by a modified SNAP process. This SNAP lithography technique successfully produced NbCn/AlN/NbCN junctions with V/sub m/ values (at 3 mV) up to 27 mV.

Niobium nitride-niobium nitride Josephson tunnel junctions have been fabricated using amorphous magnesium oxide (a-MgO) films as barriers. These junctions have excellent tunneling characteristics. For example, a large gap voltage (Vg=5.1 mV), a large product of the maximum critical current and the normal tunneling resistance (IcRn=3.25 mV), and a small subgap leakage current (Vm=45 mV, measured at 3 mV) have been obtained for a NbN/a-MgO/NbN junction. The critical current of this junction remains finite up to 14.5 K.

We report the electrical properties of all niobium nitride(NbN) Josephson tunnel junctions with magnesium oxide(MgO) films as barriers in the temperature range 4.2-15 K. NbN/MgO/NbN Josephson tunnel junctions have large gap voltages(Vg=4.8-5.4 mV), large products of the maximum critical currents and the normal tunneling resistances(IcRn=3.15-3.35 mV), and small subgap leakage currents(Vm=13-138 mV) at 4.2 K. The junction parameters decreased with increase in temperature, but reasonably large junction parameters(for example, Vg=4.9 mV, IcRn=2.67 mV, and Vm=22 mV) have been obtained even at 9 K. The magnetic penetration depth in NbN electrodes has been measured up to 15 K using two-junction interferometers which consist of NbN/MgO/NbN junctions, NbN ground planes, and NbN control lines.

We have fabricated NbTiN/Al-AlNX/NbTiN Josephson tunnel junctions on thermally oxidized Si substrates for their applications to single-flux-quantum circuits operating around 10 K. NbTiN films with a critical temperature Tcof 14.2 K and a root-mean-square value of their surface roughness of 0.45 nm were used as junction electrodes. For a junction barrier, radical-nitrided AlNXwas used to realize high uniformity in the critical current Icof the junctions. We obtained NbTiN junctions with a gap voltage Vg of 4.3 mV and an IcRn. product of 2.6 mV at 4.2 K, where R. is the junction resistance. The critical current density Jc, at 4.2 K was obtained in the range between 0.2 and 6.2 kA/cm2by changing a nitridation time for the AlNXbarrier formation. A series array of 200 junctions with an area of 10 μm × 10 μm exhibited a small I', spread, and the standard deviation 1-σ in Icuniformity was less than 1.6% in the temperature range between 4 K and 10 K.

A novel process suitable for fabrication superconducting circuitry based on the all refactory material NbN is described. In this process, and in-situ trilayer film composed of NbN/MgO/NbN is used to fabricate Josephson tunnel junctions. Reactive ion etching processes are used to delineate devices and pattern insulators and metallizations. Fabricated junctions have yielded good tunneling characteristics with reasonable current density uniformity and reproducibility. Devices with gap voltages close to 3mV have been achieved for high quality junctions (Vm 20 mV). In addition to the trilayer, there are two wiring layers, two resistor depositions, and two insulation layers, constituting a full NbN based fabrication technology. Using this process, we fabricated and successfully tested thin film DC SQUID and time domain reflectometer (TDR) circuits. Preliminary measurements suggest that the critical temperature of these circuits is well within the operating temperature of commercial two-stage closed cycle refrigerators. (Author)