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Applied Physics Letters

Wafer-level filling of microfabricated atomic vapor cells based on thin-film deposition and photolysis of cesium azide

Li‐Anne Liew, John Moreland, Vladislav P. Gerginov

Published Mar 12, 2007• 82 citations
Publisher

Abstract

The thin-film deposition and photodecomposition of cesium azide are demonstrated and used to fill arrays of miniaturized atomic resonance cells with cesium and nitrogen buffer gas for chip-scale atomic-based instruments. Arrays of silicon cells are batch fabricated on wafers into which cesium azide is deposited by vacuum thermal evaporation. After vacuum sealing, the cells are irradiated with ultraviolet radiation, causing the azide to photodissociate into pure cesium and nitrogen in situ. This technology integrates the vapor-cell fabrication and filling procedures into one continuous and wafer-level parallel process, and results in cells that are optically transparent and chemically pure.

DOI
10.1063/1.2712501

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The thin-film deposition and photodecomposition of cesium azide are demonstrated and used to fill arrays of miniaturized atomic resonance cells with cesium and nitrogen buffer gas for chip-scale atomic-based instruments. Arrays of silicon cells are batch fabricated on wafers into which cesium azide is deposited by vacuum thermal evaporation. After vacuum sealing, the cells are irradiated with ultraviolet radiation, causing the azide to photodissociate into pure cesium and nitrogen in situ. This technology integrates the vapor-cell fabrication and filling procedures into one continuous and wafer-level parallel process, and results in cells that are optically transparent and chemically pure.
This paper describes the fabrication of chip-scale alkali atom vapor cells, for use in highly miniaturized atomic frequency references, using silicon micromachining and anodic bonding technology. The cells consist of silicon cavities with internal volume ranging from a few mm/sup 3/ to less than 1 mm/sup 3/. The cells were filled with cesium and nitrogen buffer gas either by chemical reaction of cesium chloride and barium azide, or by direct injection of elemental cesium within a controlled anaerobic environment. Cesium optical absorption spectra were obtained from the cells, and coherent population trapping resonances with linewidths of about 1 kHz were measured.
We describe the fabrication of chip-sized alkali atom vapor cells using silicon micromachining and anodic bonding technology. Such cells may find use in highly miniaturized atomic frequency references or magnetometers. The cells consist of cavities etched in silicon, with internal volumes as small as 1 mm3. Two techniques for introducing cesium and a buffer gas into the cells are described: one based on chemical reaction between cesium chloride and barium azide, and the other based on direct injection of elemental cesium within a controlled anaerobic environment. Cesium optical absorption and coherent population trapping resonances were measured in the cells.
The fabrication processes of chip-scale alkali atom vapor cells are designed, which include silicon micromachining, filling arrays of miniaturized cells with rubidium azide, hermetic packaging using anodic bonding technology, and photodecomposition of rubidium azide. The improved anodic bonding technology is demonstrated and used to improve the gastight bonding of alkali atom vapor cells to the glass/silicon/glass bonding structure. After the anodic bonding of the glass and silicon wafer is finished, an Al metal film with a certain thickness is sputtered at a certain angle at the back (i.e., the glass side) and side of the glass/silicon-bonded structure. Therefore, the electrical contact is led into the silicon wafer when a second anodic bonding is performed, and a high-quality glass/silicon/glass bonding structure is realized. Such anodic structures have great bond strength and gastight bonding of as low as 2.5×10-8Pa·m3·s-1. After gastight sealing, the cells are irradiated with ultraviolet, causing the azide to photodissociate into pure rubidium and nitrogen in situ. Rubidium optical absorption spectrum indicates that rubidium atoms are effectively sealed in the cells. It is confirmed that the process for the fabrication of the chip-scale alkali atom vapor cells is simple and feasible.
Abstract We demonstrate a new technique for filling mm-scale microfabricated silicon and glass cavities with alkali vapors at the wafer-scale. A single etched silicon wafer contains an array of cavities containing alkali precursor materials offset laterally from the cell array. The wafer is heated to create an array of alkali droplets on an upper glass wafer, which is then translated laterally under vacuum and bonded to create the cells. This technique can be implemented in a commercially available bonding tool, allows the fabrication of cells with arbitrary buffer gas contents and pressures and can potentially produce cells with dimensions below 100 µm.
This paper describes the progress made in developing wafer-scale fabrication process of alkali vapor cells for chip-scale atomic devices such as Coherent Population Trapping (CPT) clocks, optical frequency standards and Rydberg-atom-based sensors. The wafer level fabrication process uses anodic bonding and introduces alkali atoms by chemical reactions of Alkali Chloride with Barium Azide. This method is compatible to make cells with a wide range of buffer gas species and pressures, including evacuated cells. We improve the yield of the cells to above 50%. We will show the residual gas pressures for evacuated cells are mostly consistent with zero within the resolution of the saturation absorption spectroscopy measurement. The temperature coefficients for the CPT spectroscopy are improved with Ar-N2 mixture buffer gas compared with only N2 buffer gas.
Microfabricated alkali vapor cells are key to enable miniature devices such as atomic clocks and optically pumped magnetometers with reduced size, weight, and power. Yet, more versatile fabrication methods are still needed to further expand their use cases. Here, we demonstrate an approach to collectively fill and seal microfabricated cesium cells using locally sealed microchannels patterned within one of the glass substrates comprising the cells. Unlike current methods that rely on wafer-level anodic bonding as the last sealing step, an approach based on local sealing opens the path to features so far limited to traditional glass-blown cells, including the ability to deposit temperature-sensitive antirelaxation coatings, reaching lower background gas pressure without an additional gettering material or filling with diverse atomic or molecular species.