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arXiv:2204.09859 · Nano Letters

Purcell Enhancement of Erbium Ions in TiO2 on Silicon Nanocavities

Alan Dibos, Michael T. Solomon, Sean E. Sullivan, Manish Kumar Singh, Kathryn E. Sautter, Connor P. Horn, Gregory D. Grant, Yulin Lin, Jianguo Wen, F. Joseph Heremans, Supratik Guha, D. D. Awschalom

Published Aug 8, 2022• 33 citations
arXivHTMLPDF

Abstract

High Resolution Image Download MS PowerPoint Slide Isolated solid-state atomic defects with telecom optical transitions are ideal quantum photon emitters and spin qubits for applications in long-distance quantum communication networks. Prototypical telecom defects, such as erbium, suffer from poor photon emission rates, requiring photonic enhancement using resonant optical cavities. Moreover, many of the traditional hosts for erbium ions are not amenable to direct incorporation with existing integrated photonics platforms, limiting scalable fabrication of qubit-based devices. Here, we present a scalable approach toward CMOS-compatible telecom qubits by using erbium-doped titanium dioxide thin films grown atop silicon-on-insulator substrates. From this heterostructure, we have fabricated one-dimensional photonic crystal cavities demonstrating quality factors in excess of 5 × 10 4 and corresponding Purcell-enhanced optical emission rates of the erbium ensembles in excess of 200. This easily fabricated materials platform represents an important step toward realizing telecom quantum memories in a scalable qubit architecture compatible with mature silicon technologies.

DOI
10.1021/acs.nanolett.2c01561

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High Resolution Image Download MS PowerPoint Slide The use of trivalent erbium (Er 3+ ), typically embedded as an atomic defect in the solid-state, has widespread adoption as a dopant in telecommunication devices and shows promise as a spin-based quantum memory for quantum communication. In particular, its natural telecom C-band optical transition and spin-photon interface make it an ideal candidate for integration into existing optical fiber networks without the need for quantum frequency conversion. However, successful scaling requires a host material with few intrinsic nuclear spins, compatibility with semiconductor foundry processes, and straightforward integration with silicon photonics. Here, we present Er-doped titanium dioxide (TiO 2 ) thin film growth on silicon substrates using a foundry-scalable atomic layer deposition process with a wide range of doping controls over the Er concentration. Even though the as-grown films are amorphous after oxygen annealing, they exhibit relatively large crystalline grains, and the embedded Er ions exhibit the characteristic optical emission spectrum from anatase TiO 2 . Critically, this growth and annealing process maintains the low surface roughness required for nanophotonic integration. Finally, we interface Er ensembles with high quality factor Si nanophotonic cavities via evanescent coupling and demonstrate a large Purcell enhancement (≈300) of their optical lifetime. Our findings demonstrate a low-temperature, nondestructive, and substrate-independent process for integrating Er-doped materials with silicon photonics. At high doping densities this platform can enable integrated photonic components such as on-chip amplifiers and lasers, while dilute concentrations can realize single ion quantum memories.

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High Resolution Image Download MS PowerPoint Slide Isolated solid-state atomic defects with telecom optical transitions are ideal quantum photon emitters and spin qubits for applications in long-distance quantum communication networks. Prototypical telecom defects, such as erbium, suffer from poor photon emission rates, requiring photonic enhancement using resonant optical cavities. Moreover, many of the traditional hosts for erbium ions are not amenable to direct incorporation with existing integrated photonics platforms, limiting scalable fabrication of qubit-based devices. Here, we present a scalable approach toward CMOS-compatible telecom qubits by using erbium-doped titanium dioxide thin films grown atop silicon-on-insulator substrates. From this heterostructure, we have fabricated one-dimensional photonic crystal cavities demonstrating quality factors in excess of 5 × 10 4 and corresponding Purcell-enhanced optical emission rates of the erbium ensembles in excess of 200. This easily fabricated materials platform represents an important step toward realizing telecom quantum memories in a scalable qubit architecture compatible with mature silicon technologies.
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The use of trivalent erbium (Er3+^{3+}3+), typically embedded as an atomic defect in the solid-state, has widespread adoption as a dopant in telecommunications devices and shows promise as a spin-based quantum memory for quantum communication. In particular, its natural telecom C-band optical transition and spin-photon interface makes it an ideal candidate for integration into existing optical fiber networks without the need for quantum frequency conversion. However, successful scaling requires a host material with few intrinsic nuclear spins, compatibility with semiconductor foundry processes, and straightforward integration with silicon photonics. Here, we present Er-doped titanium dioxide (TiO2_22​) thin film growth on silicon substrates using a foundry-scalable atomic layer deposition process with a wide range of doping control over the Er concentration. Even though the as-grown films are amorphous, after oxygen annealing they exhibit relatively large crystalline grains, and the embedded Er ions exhibit the characteristic optical emission spectrum from anatase TiO2_22​. Critically, this growth and annealing process maintains the low surface roughness required for nanophotonic integration. Finally, we interface Er ensembles with high quality factor Si nanophotonic cavities via evanescent coupling and demonstrate a large Purcell enhancement (300) of their optical lifetime. Our findings demonstrate a low-temperature, non-destructive, and substrate-independent process for integrating Er-doped materials with silicon photonics. At high doping densities this platform can enable integrated photonic components such as on-chip amplifiers and lasers, while dilute concentrations can realize single ion quantum memories.
Defects and dopant atoms in solid state materials are a promising platform for realizing single photon sources and quantum memories, which are the basic building blocks of quantum repeaters needed for long distance quantum networks. In particular, trivalent erbium (Er3+) is of interest because it couples C-band telecom optical transitions with a spin-based memory platform. In order to produce quantum repeaters at the scale required for quantum networks it is imperative to integrate these necessary building blocks with mature and scalable semiconductor processes. In this work, we demonstrate the optical isolation of single Er3+ ions in CMOS-compatible titanium dioxide (TiO2) thin films monolithically integrated on a silicon-on-insulator photonics platform. Our results demonstrate an initial step toward the realization of a monolithically integrated and scalable quantum photonics package based on Er3+ doped thin films.
Solid-state spin-based quantum systems have emerged as popular platforms for quantum networking applications due to their optical interfaces, their long-lived quantum memories, and their natural compatibility with semiconductor manufacturing. Photonic crystal cavities are often used to enhance radiative emission; however, fabrication of the necessary subwavelength cavities is typically limited to small batch electron beam lithography. In this work, we demonstrate high quality factor, small mode volume nanobeam cavities fabricated on a scalable silicon photonic foundry platform. The foundry fabricated cavities are then interfaced with single erbium ions through backend deposition of TiO 2 thin films lightly doped with erbium. Single ion lifetime measurements indicate Purcell enhancement up to about 500, thereby demonstrating a route toward manufacturable deterministic single photon sources in the telecom C-band.
Rare-earth ion defects in solid-state hosts have emerged as a promising candidate for emissive quantum memories owing to their inherent spin–photon interface and long optical and spin coherence times. Erbium (Er3+) in particular has optical transitions in the C-band making it well suited to the use of existing telecom technology infrastructure. In this work, we present a platform to integrate rare-earth ions into standard silicon photonic circuits. Erbium is co-deposited in CMOS-compatible TiO2 host films onto SOI and patterned into high Purcell factor photonic crystal cavities. Purcell factors in excess of 500 are observed and transient spectral hole burning and photoluminescence excitation scans reveal homogeneous linewidths below 15 MHz. Additionally, we show that photonic wirebonding can provide a solution for low-loss and thermally stable fiber-to-chip coupling.
Implementation of large-scale quantum networks have the potential to augment the capabilities of existing quantum information technologies. By linking quantum processors over photonic channels, future quantum networks could enable applications such as remote quantum sensing, distributed quantum computing, and secure quantum communication. Atomic defects in solids are readily integrated with photonic structures, making them promising candidates for use in quantum networking devices. In particular, the silicon material platform holds great promise due to the technologically mature silicon electronic and photonic industries. The T center defects in silicon possess telecom O-band optical transitions, as well as long-lived electronic and nuclear spins, making it the focus of particular interest. These spin and optical properties of single T centers, together with their accessibility to the existing integrated electronic and photonic technologies, opening the door to modular long-distance quantum networking technologies built on the T center platform. This work outlines the integration of single T centers with a silicon photonic crystal cavity; we observe cavity-enhanced fluorescence emission, resulting in a decay rate enhancement factor of F = 6.89 compared to the bulk emission rate. Through the use of silicon photonic circuits and an angle-polished fiber for light coupling, we achieve a maximum zero phonon line photon outcoupling rate of 73.3 kHz. The design and fabrication of the nanophotonic cavity used in experiment is detailed. This work represents a major step towards use of the silicon T center as a telecom spin-photon interface in future quantum networking applications.