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arXiv:2101.02508 · Optics Express

Surviving entanglement in optic-microwave conversion by an electro-optomechanical system

Yonggi Jo, Su-Yong Lee, Yong Sup Ihn, Dongkyu Kim, Zaeill Kim, Duk Y. Kim

Published Feb 12, 2021• 4 citations
arXivHTMLPDF

Abstract

In recent development of quantum technologies, a frequency conversion of quantum signals has been studied widely. We investigate the optic-microwave entanglement that is generated by applying an electro-optomechanical frequency conversion scheme to one mode in an optical two-mode squeezed vacuum state. We quantify entanglement of the converted two-mode Gaussian state, where surviving entanglement of the state is analyzed with respect to the parameters of the electro-optomechanical system. Furthermore, we show that there exists an upper bound for the entanglement that survives after the conversion of highly entangled optical states. Our study provides a theoretical platform for a practical quantum illumination system.

DOI
10.1364/oe.419385

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Entangled continuous variable (CV) Gaussian states with different wavelengths plays a central role in recent CV-based approaches to quantum network, quantum information processing and quantum metrology. Typically, experiments demonstrating CV entanglement exploit the optical parametric frequency down conversion. Due to the probabilistic nature of photon pair generation, the entanglement involving the post-selection of photonic qubits is limited to at most three colors. Here We theoretically present a scheme for the deterministic generation of entanglement among bright multicolor CV Gaussian states from an optomechanical system using existing experimental technologies. In our scheme an optical frequency comb is input into an optomechanical resonator and then the amplified optomechanical coupling makes multipartite entanglement among them. Our scheme overcomes the limitation of usable frequency of entangled CVs in frequency conversion process. It can be extended to generate multipartite entanglement between orthogonal modes with a single frequency or between microwave and optical CVs, or even among a microwave frequency comb. This optomechanical device can be integrated on a chip.
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